抄録
The suitability of X-ray reflectometry using the Cu-Kβ line for layered structure analysis of NiFe/Cu/NiFe/Ta layered films was studied. Structural parameters such as film thickness, density, and interface width can be deter-mined more accurately than by Cu-Kα1 X-ray reflectometry, owing to the abnormal dispersion effect. The standard deviations in determination of film thicknesses were within ±0.3% for NiFe and Ta films and ±0.03 nm for 2 nm Cu film. Those for the densities and interface widths were within ±2 and ±0.04 nm for all films, respectively. Analysis of some layered films regarding the change in Cu film thickness showed that in all these samples the density of the films most closely reflected the density of bulk material, and the interface width between the upper NiFe and Cu films increased with increasing Cu film thickness.
