JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 62nd JSAP Spring Meeting 2015
Session ID : 11a-A29-1
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Characteristics of PVD-Co(W) film for highly reliable ULSI-Cu interconnect
*Takeshi MomoseKota TomitaTakaaki TsunodaTakashi NakagawaYukihiro Shimogaki
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© 2015 The Japan Society of Applied Physics
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