The 62nd JSAP Spring Meeting 2015
Session ID : 11a-A29-1
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 62
Location : [in Japanese]
Date : March 11, 2015 - March 14, 2015
Characteristics of PVD-Co(W) film for highly reliable ULSI-Cu interconnect
*Takeshi Momose, Kota Tomita, Takaaki Tsunoda, Takashi Nakagawa, Yukihiro Shimogaki
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