The 63rd JSAP Spring Meeting 2016
Session ID : 19p-W621-12
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 63
Location : [in Japanese]
Date : March 19, 2016 - March 22, 2016
Dry Desmear technology for High-density Packaged PCB.
Muneyuki Satou, Yasuhiro Morikawa, *Takahide Murayama, Noriaki Tani, Yoneda Masahiro
Author information
Details
Article 1st page
