The 63rd JSAP Spring Meeting 2016
Session ID : 20p-W323-14
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 63
Location : [in Japanese]
Date : March 19, 2016 - March 22, 2016
Fabrication of ultrathin Ge-on-insulator by direct wafer-bonding
Details
Article 1st page
