抄録
Recently, the development of machine tools and sub-micron position-control techniques has brought the minimum thickness of ultra-precision grinding or cutting to less than 1 nm. The conventional finite-element method (FEM) becomes impossible to use for numerical analysis since the focused region and mesh is very small. As another disadvantage of FEM, micro property of the material such as crystalloid was not taken into consideration. As an alternative method, molecular dynamics (MD) method is significantly implemented in the field of micro-cutting, indentation and crack propagation. However, enormous time to calculate the interaction between molecules notably hampered the wide use for large-scale MD simulation. In this paper, firstly, parallel MD based on spatial decomposition and particle decomposition is constructed to reduce the calculation time whose efficiency will be evaluated in supercomputer by benchmark test. Secondly, parallel MD is used to carry out the large-scale nanometric grinding simulation with respect to different condition. By comparison between the simulation results, it is made clear that, variation of the cutting force is dependant on dislocation of the workpiece lattice; the cutting force is approximately equivalent as the wear of tool takes place; and the property of machined surface and temperature distribution is influenced by the cutting speed.
