Study on the Thermal Stress at Ceramics-Metal Joint

抄録

This study was carried out to decrease the residual stress that developed during the cooling of a ceramic-metal bonded joint. The analysis connected with the thermal stresses and the residual stresses was performed using the finite-element method and the boundary element method. The analysis clarified the effect of some factors (E^B/E^A, v^A, v^B, h^A/b, h^B/b) on the residual stress in ceramics. Several kinds of test pieces that differed in the shape of the joint were devised for decreasing the residual stress in ceramics in the neighborhood of the bond line. The experimental results of bonding of Si₃N₄ to Cr-Mo steel using a copper insert layer showed that changing of the joint shape was effective in decreasing the residual stress.