抄録
Recently, the development of machine tools and sub-micron position-control techniques has brought the minimum thickness of ultra-precision grinding or cutting to less than 1 nm. The conventional finite-element method (FEM) becomes impossible to use for numerical analysis since the focused region and mesh is very small. As another disadvantage of FEM, the material micro property such as crystalloid was neglected. In order to obtain valuable result, another method, in place of the conventional finite-element method, must be considered. As an altemative method, molecular dynamics method is significatly implemented in the field of micro-cutting, indentation and crack propagation. Moreover, since speed of computer came to considerable fast and parallel computing technology grew mature in the last two decades, tendency of CAE (Computer Analysis Engineering) toward micro level or macro level become stronger. In this paper, the phenomenon of ultra-precision grinding with sub-nanometer chip thickness is studied on basis of molecular dynamics. In addition, general parallel computing technology, spatial decomposition is endeavored to improve the calculation efficiency.
