抄録
SPH method is applied to micro crack propagation analysis at solder beads of a semi-conductor. In this study thermal conduction analysis and stress analysis are combined successfully. First thermal conduction analysis is performed during a time interval. Temperature distributions before and after the analysis are used to evaluate thermal stress analysis where the stress propagation induces micro crack growth at and near the solder beads. The thermal analysis and stress analysis are performed mutually about 100 times till the temperature variations are ceased. The micro crack propagations are observed clearly in the SPH combination analysis.
