設計工学・システム部門講演会講演論文集
Online ISSN : 2424-3078
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1403 携帯電話機実装基板の構造信頼性設計システムの開発
坂本 博夫高田 志郎西村 浩之伊藤 順子
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会議録・要旨集 フリー

p. 152-153

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This paper presents development of structural reliability design system of printed-circuit assembly in a cellular mobile phone. To realize the reliability design at the early stage of design, an efficient FEM model was proposed, and the fatigue strength database was developed by using 4-point bending test and simulation. The structural reliability design of printed-circuit assembly takes about 30 minutes on entire keys and the estimated life for key pressing operation of trial products was in good agreement with experimental results.
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© 2003 一般社団法人 日本機械学会
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