In this paper, we present a practical simulation system for designing phase change cooling devices. The proposed system is based on ID thermal-fluid network analysis, which achieves good simulation accuracy by means of newly introduced models for evaporator wick and condenser fins. Based on this system, cooling performance is rapidly evaluated and design optimization can be easily achieved by automatically modifying simulation parameters in response to design changes. As a typical phase change cooling device, we focus on loop heat pipe (LHP) and confirm the ability of the system by applying it to cooling system design of server systems, where cooling performance is maximized by parametric study of ID for the number of condenser fins and polar diameters of wick.
