抄録
Authors proposed ultrasonic cleaning machine using the ultrasonic waveguide mode in order to reduce damage of the LSI pattern or to clean the wafer after CMP cleaning process. The sound pressure emitted at the end of the waveguide is applied to cleaning the wafer in the same way of the conventional cleaning equipment. Additionally, the sound pressure emitted through the side surface of the waveguide is also applied to the wafer cleaning process. Authors also proposed the sound pressure measurement method for the large magnitude and high frequency ultrasonic in the case that conventional hydrophone cannot be applied.
