抄録
In recent years, higher mechanical properties are being demanded in thin sheets of copper alloys with the miniaturization of electric and electronic parts. Above all, because the materials for connector are usually subjected to heavy bending, good bendability is especially required together with strength, electrical conductivity, etc. In this study, effect of microstructure on the bendability of a Corson series copper alloy sheets was investigated. The alloy was melted, cast, hot-rolled to 12mm thickness, scalped to 11mm thickness, cut into specimens, cold-rolled, intermediate-annealed at temperatures ranging from 300 to 450℃, cold-rolled by a reduction between 10 and 30% and finally solutionized at 800℃ for 1h Strongest cube texture was found in the sheet intermediate-annealed at 450℃ for 2h, cold-rolled by 30% and finally solutionized. The relationship between the texture and bendability will be discussed.