抄録
Self-assembly is emerging as one of the promising methods for construction of heterogeneous systems consisting of multiple component types in nano- and micro-scales. The engineered self-assembly used for system integration involves preparation of parts, and self-assembly of these parts into a system. In this work, we carried on a micro assembly process based on capillary-driven self-assembly in an air environment. Mechanically diced square silicon parts, ranging from 100 umx 100 um to 1 mm × 1mm, with flat edges were used in this study to clarify the effect of bonding area on capillary-driven self-assembly. The shape recognition or size matching between the parts and substrates was also experimentally observed and qualitatively discussed. The opportunities and challenges ahead in the development of system integration processes taking advantage of self-assembly are further briefly considered.
