Abstract
Over the past few decades, rapid strides have been made in high speed and high precision wire bonding, which is one of semi-conductor assembling processes. The high speed and precision are mainly realized by XY-table and bonding head of wire bonder. Especially XY-table requires low vibration after high speed positioning. This paper reports that our accomplishment in developing the low vibration AY-table, which consists of liner motor and has the structure of high natural frequency.
