抄録
On YAG laser and diode laser soldering, the solderability of eutectic solder alloy (63Sn/37Pb) and lead-free solder alloy (Sn-Ag-Cu) paste were examined. Observational tests were performed in order to determine the limits of processing parameter; laser power density, and irradiation time adequate to soldering. In these better conditions, temperatures of solder joints have been investigated using thermocouple during laser irradiation. Joint strength tests were conducted on coating thickness of 0.2,0.3,0.4mm of solder paste, which it is important to study the effect of changes before and after thermal shock cycle by gas phase method. As a result, the lead-free solder alloy enables to substitute for Sn-Pb alloy in laser soldering. Diode laser is more adaptable for lead-free solder alloy than YAG laser.
