抄録
Recently miniaturization of electronic equipment such as mobile phone or personal computer requires high density packages such as BGA or CSP. It is necessary for us to confirm the solder joint reliability of the electronic packages because the solder joint must be under higher stress and higher temperature. FEM simulation is useful method for such evaluation. However, it is difficult for a designer to evaluate solder joint reliability with FEM simulation, because solder joint deformation under thermal stress is complex phenomenon including creep deformation and stress singularity between two metals. Therefore professional FEM analyst needed to evaluate the FEM results. Authors develop effective simulation system PAMS1 for BGA solder joint, including modeling, meshing and evaluation. In this article, an application examples explained.
