日本機械学会関東支部総会講演会講演論文集
Online ISSN : 2424-2691
ISSN-L : 2424-2691
セッションID: 21707
会議情報
21707 CMPコスト削減のためのCuめっきの平坦化技術(配線2,OS.12 機械工学が支援する微細加工技術(半導体・MEMS・NEMS))
倉科 敬一中田 勉辻村 学
著者情報
会議録・要旨集 フリー

詳細
抄録
A new copper interconnect plating process which uses a porous pad with enormous fine through-holes is proposed and examined. Plating with the pad pushed on a wafer surface provides a flat overburden copper film with a lot of tiny posts on a patterned structure. These posts can be removed very easily by chemical etching, and there remains only a flat and minimum overburden copper film without any posts. This copper film can be polished easily and shortly by CMP, and results in a good step property.
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© 2007 一般社団法人 日本機械学会
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