エバネッセント光を用いたナノスケール洗浄現象の可視化に関する研究

（被洗浄表面近傍の流速分布観測）

抄録

Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, the residual nanoparticles from polishing slurry on the wafer are usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been studying these phenomena by visualizing the nanoparticle motion on a surface in nanoscale wet cleaning process that are duplicated in lab-scale. This report focuses on the flow velocity distribution occurring on a surface that was obtained by duplicating the water flow in a micro fluid cell on a silica glass surface. We found that the flow, which is nearer than few micrometers from the surface being cleaned, has less shear flow velocity. Therefore, there should be some external force or energy, such as PVA brush or cavitation from ultrasonic, to remove residue particles in cleaning process.