抄録
A new slicing method of monocrystalline silicon ingot using wire electrical discharge machining was proposed for high efficiency and high quality slicing instead of inner diameter blade or multi-wire method. The effects of supply method of working fluid and wire speed on machining characteristics were experimentally investigated. It is clarified that the immersion method is superior than the nozzle supply method and the wire speed over 200m/min is desirable for stable machining. Besides, mounting of wire sub-guide is useful for obtaining better kerf shape.