Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
2007.4
セッションID: 7B210
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Grinding of C/C-SiC Composite
*Tetsuya TASHIROJunsuke FUJIWARA
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C/C-SiC composite was ground with SD400 and SD4000 grinding wheel. The grinding forces of the SD4000 were bigger than that of other grinding wheels and some cracks were observed on the ground surface. There was severe loading on the SD4000 wheel. In case of the SD400 wheel, three types of grinding wheels which had different concentration were used. There were some places where the depth of cut was bigger than the set value of the depth of cut in the concentration 150. The SD400 wheel of the concentration 50 was suitable among the SD400 wheels from the point of the cost.
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© 2007 The Japan Society of Mechanical Engineers
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