Proposal of Optimum Grinding Cycles for Removal of Surface Damaged Layers

抄録

In this study, in order to remove the surface damaged layers and to shorten the grinding time, a principle of designing method of optimum grinding cycle is proposed. This optimum grinding cycle consists of two infeed processes and one spark-out process. In the first infeed process, depth setting is settled larger than one of usual grinding process. In the second infeed process, in order to remove damaged layers generated in the first infeed process, depth setting is settled smaller than previous process.