抄録
This study aims to clarify the silicon wafer grinding mechanism by a diamond wheel at nanometer level to support the estimation of grinding conditions for minimizing the surface defect, for maximizing the removal rate and so on. In this paper, several nanoscratching experiments using an atomic force microscope (AFM) were conducted on a silicon wafer workpiece by a diamond abrasives and a sharpen diamond probe under various machining and environmental conditions. As a result, the transcription of diamond tool locus and the influence of the temperature on material removal process were clarified.
