Chemical Etching of Copper Surface by Fluorescent Substance Excited with Ultraviolet Ray

－Study of Ultraviolet Ray-Assisted Machining－

抄録

This paper describes the processing characteristics of copper which ultraviolet ray was exposed on. The irradiation of ultraviolet ray increased the etching rate of copper, and the surface roughness becomes small. The irradiation by ultraviolet ray improves the surface roughness over all condenses of processing liquid. The minimum surface roughness was obtained at the appropriate irradiate time, pH, and the height of liquid level. The temperature arise of liquid decreases the surface roughness of copper.