Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
セッションID: A33
会議情報
A33 Research on Chemical Reaction Assisted Ultra-short Pulsed Laser Cleavage-cutting of Silicon Wafer(M4 processes and micro-manufacturing for science)
Takashi MIZOGUCHILibo ZHOUJun SHIMIZUHirotaka OJIMATakeyuki YAMAMOTO
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Blade dicing by use of diamond blades is the conventional process for separating IC chips, however, encounters many problems including cracks and chippings during the process. On the other hand, Laser machining is expected to be free from these problems. This study aims to develop the ultra-short pulsed Laser cleavage-cutting process by the assistance of chemical reaction to improve process efficiency and process accuracy. In the experiments, single crystal silicon wafers were irradiated by a pico-second pulsed Laser under various conditions, such as TMAH concentration and pulse energy to acquire the fundamental data for precise Laser cleavage-cutting.
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© 2009 一般社団法人 日本機械学会
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