抄録
Blade dicing by use of diamond blades is the conventional process for separating IC chips, however, encounters many problems including cracks and chippings during the process. On the other hand, Laser machining is expected to be free from these problems. This study aims to develop the ultra-short pulsed Laser cleavage-cutting process by the assistance of chemical reaction to improve process efficiency and process accuracy. In the experiments, single crystal silicon wafers were irradiated by a pico-second pulsed Laser under various conditions, such as TMAH concentration and pulse energy to acquire the fundamental data for precise Laser cleavage-cutting.