抄録
To understand the material removal mechanism in MCF polishing process, distributions of pressure and shear stress in polishing zone during MCF polishing are investigated. Larger pressure occurs at the position which is closer to the center of MCF slurry, and the maximum shear stress appears at the position of about 5 mm from MCF slurry center. MCF carrier rotation speed and working gap have strong correlations with the material removal rate (MRR) while magnet revolution speed shows a little effect on MRR. Shear stress shows more influence on MRR than pressure. A MRR model including both shear stress and pressure is proposed.
