抄録
To expose the material removal mechanism in ultrasonic assisted grinding (UAG) of SiC ceramics, the deformation features of SiC ceramics in ultrasonic assisted scratching (UAS) tests were investigated and compared with those in conventional scratching (CS). The results revealed that the scratching force varies periodically and the scratching trace appears to be sinusoidal in UAS. It was also found that the scratching groove generated in CAS is deeper than that in CS and the sizes of lateral cracks are increased owing to the impact of the tool generated in UAS process.
