抄録
A laser cleaving is gathering attention as alternative dicing method for brittle hard materials such as SiC and glass. However, laser cleaving has problems about processing speed and impairment of precision in specific processing condition. To solve these problems, in past studies, analytic observations of stress distribution have been conducted. In this paper, in contrast, experimental observation of stress distribution is carried out by photoelastic technique. As results, in the case of processing of near free edge, asymmetrical distribution with the laser path is observed by photoelastic observation. This asymmetrical distribution cause degrading precision of cleaving line.
