Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
セッションID: 2207
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2207 Effects of Ultrasonic Vibration on Abrasive Pellet Working Life for Si Wafer using Ultrasonic Assisted Fixed Abrasive Chemical Mechanical Polishing(UF-CMP)
Mitsuyoshi NOMURAYutaka MATSUSHIMAYongbo WUMasakazu FUJIMOTOZhou LIBO
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In machining of Si wafer, high efficiency and high precision processing is demanded. This paper presents the high efficiency mirror finishing of Si wafer using chemical-mechanical machining of fixed abrasive assisted ultrasonic vibration. Ultrasonic chemical-mechanical machining system has been designed and machining experiments have been carried out to clarify fundamental machining properties of proposed method. As a result, the working life of the abrasive pellet becomes longer by suppressing the loading with the ultrasonic vibration; the polishing chip becomes small when ultrasonic vibration is applied. From these results, it is shown that made of defect-free mirror surface is easily compared with traditional chemical-mechanical grinding method.
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© 2015 一般社団法人 日本機械学会
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