Analysis of variance in optical inspections of wafer thickness

Teppei ONUKI; Hirotaka OJIMA; Jun SHIMIZU; Libo ZHOU

doi:10.1299/jsmelem.2017.9.004

抄録

In this study, error characteristics of the thickness measurements are systematically investigated to obtain true thickness profiles of the wafers under uncertain measurement conditions. Specified factors of disturbing signals in spectroscopic data are analyzed regarding misalignment of the measurement instruments, surface integrity of wafers, and post analysis of spectroscopic data; for the causality inferences in the aberrant features in reflection spectroscopic measurements.

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