Ultraprecision cutting of silicon carbide using micro milling tool of single crystalline diamond

抄録

In order to machine harder silicon carbide molds precisely, micro milling tools made of single crystalline diamond (SCD) were fabricated by using laser fabrication process. Several cutting edges were fabricated three-dimensionally by a laser beam on the edge of a cylindrical SCD. SiC wafers with a flat face were cut with the developed tool to evaluate the tool wear rate and its life. Some micro aspheric molds of SiC were cut with the tool at a rotational speed of 50,000 min^-1. The molds were cut in the ductile mode. The form accuracy obtained was approximately 100 nm P-V, and the surface roughness was 14 nm Rz.