主催: The Japan Society of Mechanical Engineers
会議名: 第9回 21世紀における先端生産工学・技術に関する国際会議 (LEM21)
開催日: 2017/11/13 - 2017/11/17
The application of optical products using Laser or LED spreads through industry, and the precise assembly technologies become more important. This study explained the optimization of UV-curing adhesive bonding and the visualization method of measuring adhesive shrinkage. To reduce this adhesive shrinkage, new two type 3-dimensional double-sided adhesive bonding methods were devised. The accuracy of “Double-sided balancing adhesive bonding method” can be reduced below 1/3 of the conventional one, and the “Contacting one side and double-sided adhesive bonding method” is in less than 1/20 in micro meter order.
