年次大会
Online ISSN : 2424-2667
ISSN-L : 2424-2667
セッションID: G030084
会議情報
G030084 テンプレート法による高密度Cuナノワイヤアレイの作製および評価([G03008]材料力学部門一般セッション(8):材料の電気的特性)
岩崎 由佳巨 陽森田 康之細井 厚志
著者情報
会議録・要旨集 フリー

詳細
抄録
Characteristic of nanowire is gradually attracting many researchers with potential applications of nano devices, nano sensors, solar sells and so on. This paper describes fabrication and evaluation of high density Cu nanowire array grown in porous aluminum. To fabricate high density nanowire array, at first Ta and Cu films were evaporated on one side of Si wafer as a conductive working electrode. Nanowire array was formed via electrical deposition in copper sulfate aqueous solution. After etching in 2 M NaOH aqueous solution to remove porous aluminum, we obtained high density nanowire array on Si wafer perpendicular to its surface. High density Cu nanowires with average diameter of 200 nm, approximately, were observed by scanning electron microscope. In order to understand performances of Cu nanowire array, electrical and mechanical properties of them were studied in details.
著者関連情報
© 2011 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top