抄録
Thin dicing blades are widely used for cutting hard-brittle materials such as ceramics, quartz, and semiconductor devices. In the cutting process, the sharpness of the dicing blades effect on the cutting characteristic. In order to improve the cutting characteristic of the dicing blades, authors developed the porous electroforming blade in this study. When we add pore forming agent in plating bath, the electroforming blades have porous structure. The porous electroforming blades have different pore rate and same abrasive grain of concentration. In an effort to judge sharpness of the electroforming blades, authors use manufactured electroforming blades as cutting silicon wafer. We measure most chipping size in per 50|im. This data translate into chipping size distribution. The electroforming blades have more pore, chipping size become smaller. As the results, it was known that the sharpness of the porous blades is better than that of traditional ones.
