抄録
The Warpage behavior for viscoelastic three-layer laminated structure consisting of steel/epoxy resin/printed board which modeled electronic devices simply caused by a series of thermal load from heating to cooling was examined experimentally. On another front, its warpage behavior was calculated by thermo-viscoelastic stress/deformation analysis program based on linear viscoelastic theory which developed by ourself. And, those experimental values were compared with the theoretical values. As a result, it was clarified that the experimental values of warpage are good agreement with the thermo-viscoelastic analysis values. In addition, the warpage behavior of viscoelastic three-layer laminated structure are influenced not only by the material properties such as glass transition temperature, modulus of longitudinal elasticity and thermal expansion coefficient which are depended on temperature and flexural rigidity based on the thickness, width of three-layer laminated structure.
