年次大会
Online ISSN : 2424-2667
ISSN-L : 2424-2667
セッションID: J012025
会議情報
J012025 熱負荷による三層積層体の反り変形挙動に及ぼす層構成の影響([J012-02]電子情報機器、電子デバイスの強度・信頼性評価と熱制御(2))
中村 省三勝山 陽介桑野 孝之
著者情報
会議録・要旨集 フリー

詳細
抄録
The Warpage behavior for viscoelastic three-layer laminated structure consisting of steel/epoxy resin/printed board which modeled electronic devices simply caused by a series of thermal load from heating to cooling was examined experimentally. On another front, its warpage behavior was calculated by thermo-viscoelastic stress/deformation analysis program based on linear viscoelastic theory which developed by ourself. And, those experimental values were compared with the theoretical values. As a result, it was clarified that the experimental values of warpage are good agreement with the thermo-viscoelastic analysis values. In addition, the warpage behavior of viscoelastic three-layer laminated structure are influenced not only by the material properties such as glass transition temperature, modulus of longitudinal elasticity and thermal expansion coefficient which are depended on temperature and flexural rigidity based on the thickness, width of three-layer laminated structure.
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