抄録
In Micro Electro Mechanical Systems (MEMS) technology, thick film structure is manufactured by sputter deposition and lift-off process. However, its thickness is not uniform because lift-off masking material block off. The structure thickness is low in the vicinity of lift-off masking material, and its cross-sectional shape is not rectangular. Thick film structure design is limited by this problem. Furthermore, it is hard to build uniformly electrical factors on the thick film structure surface. In this paper, we propose compound micro process for thick film structure with the sputtering jig, which combines projection surfaces and spacers. In the new compound micro process, since thick film structure is formed on the projection plane, the film thickness does not decrease as compared with lift-off process. Thereby, electrical factors can be built on the thick film structure surface. That structure is separated from the sputtering jig by removal of sacrificial layers and pacers. By removing the extra burr, thick film structure that has rectangular cross section and uniform thickness is made. In this way, we have successfully fabricated two-axis scanning micro mirror device with thin film metallic glass Cu-Zr-Ti, which have uniform film thickness, rectangular cross-sectional shape and electrical factors.
