SiC基板のPCDブレードによる送水加工技術

抄録

We aimed to machine grooves without chipping on SiC substrates using a PCD blade. In this study, three types of water supply methods, dry processing, water processing, and coated water processing were compared and evaluated each other. The evaluation methods were performed by the groove surface condition of the SiC substrate, grinding resistance, and the temperature at the side of the blade. These results indicate that coated water processing is the best way to cool down the blade surface and to eliminate cutting chips from the groove.