ファイバーコンディショナーによるCMP研磨パッド表面コンディショニング技術の研究

抄録

This research has developed a fiber conditioner that can grind more uniformly and finer than conventional types of conditioners used to maintain the surface condition of polishing pads in the semiconductor CMP process. Evaluation of the cut rate and measurement of chips showed that the fiber conditioner can grind more finely than conventional types. In addition, evaluation of the conditioner's flutter using an AE sensor and removal rate revealed that it can condition the entire polishing pad more uniformly than the conventional type.