抄録
Delamination between thin films is classified into two types : opening mode and sliding mode. However, these mechanisms have not been examined because it is not easy to conduct experiments of the delamination of sub-micron thin film under opening mode and sliding mode, separately. This paper aims to evaluate interface strength of the delamination of the sub-micron thin film for sliding mode, respectively. We already developed the test method for opening mode elsewhere. Test method of sliding mode is proposed and the interface strength between thin films for an LSI is. Stress analysis reveals that the singularity of shear stress causes the initiations fo delamination of sliding modes. On the basis of fracture mechanics concepts, the criterion of crack initiation for each mode is evaluated as the interface toughness. The value of fracture toughness in sliding mode is smaller than that in opening mode. It shows that it is important to evaluate the interface strength for each mode.
