年次大会講演論文集
Online ISSN : 2433-1325
セッションID: 2257
会議情報
2257 横波散乱波を用いた材料内部界面の画像化(S26-3 非破壊評価とモニタリング(3),S26 非破壊評価とモニタリング)
川嶋 紘一郎山田 龍三松田 正文
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会議録・要旨集 フリー

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抄録
A new ultrasonic imaging technique of microstructures in engineering materials is proposed, in which the shear waves back scattered by microstructures are detected by a point-focused transducer. By focusing the ultrasonic shear waves on a certain point on the micro structures such as interfaces of dissimilar materials and micro cracks, and extracting the back scattered signal in a particular frequency domain, the amplitude of the wave is mapped. The method is applied to image semi-closed fatigue crack surfaces, which are unable by usual ultrasonic imaging of reflected longitudinal or shear wave. Also, this method is combined with 2^<nd> harmonic measurement to visualize weakly bonded interfaces of spot welds.
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© 2005 一般社団法人日本機械学会
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