2713 超薄型放熱板用マイクロフィンの形成技術と放熱特性(S33-1 材料の超精密加工とマイクロ/ナノ加工の動向(1),S33 材料の超精密加工とマイクロ/ナノ加工の動向)

抄録

The heat sink and the fan have been equipped as the discharge device for the accumulated heat inside of a notebook PC and digital appliances. The development of innovative heat dissipation technology would be expected from their causing noise and the increase in the cost. In this research, the high efficient heat dissipation thin board was developed by forming the fine slots in a micrometer order. As result of the experiment, the heat dissipation performance was found to be improved using the micro fin.