M&M材料力学カンファレンス
Online ISSN : 2424-2845
セッションID: OS1502
会議情報
OS1502 純銅箔の機械的特性に及ぼす箔厚の影響(OS15-1 性能の発現と機構,OS-15 微視構造を有する材料の変形と破壊)
藤井 朋之野田 益宏東郷 敬一郎島村 佳伸
著者情報
会議録・要旨集 フリー

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抄録
This paper deals with influence of foil thickness on mechanical property of copper foil. Tensile tests were carried out for annealed Cu foils. The influence of foil thickness on the deformation, tensile strength and fracture morphology were investigated. In order to examine the mechanical property of Cu foils, the thickness of Cu foils ranges from 5 to 2000 microns and the average grain size of each specimen is 20 microns. The tensile strength of the foil thickness of 5 and 10 microns were lower than that of thicker foil. While the chisel-point fracture occurs if the grain size is larger than foil thickness, the intergranular fracture is observed if the grain size is smaller than foil thickness. The results are explained on the basis of texture differences; the deformation is constrained by the other nearby grains and the number of grain in the thickness direction decreases with increasing foil thickness. In the case of thickness 5 and 10 microns, only one grain exists through thickness direction. Therefore, the mechanical properties of the thinner foils are affected by foil thickness.
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© 2011 一般社団法人 日本機械学会
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