M&M材料力学カンファレンス
Online ISSN : 2424-2845
セッションID: OS1802
会議情報
OS1802 SEMを用いたデジタル画像相関法による熱ひずみ計測を用いた三次元積層チップの非線形有限要素解析精度評価
岡 大智池田 徹宮崎 則幸松本 圭司小原 さゆり折井 靖光山田 文明嘉田 守弘
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会議録・要旨集 フリー

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Numerical methods such as the finite element method (FEM) have been used to evaluate the reliability of electronic packages. However, it is difficult to assure the accuracy of numerical analyses of electronic packages, which require nonlinear analyses. In this study, we evaluated the thermal strain of a test chip for three-dimensional stacked integrated circuits (3D SIC) with both measurement and numerical analyses. First, the distribution of the thermal strain on the cross-section of a test chip was measured using scanning electron microscope (SEM) and the digital image correlation method (DICM [1]). Then, the distribution of strain of the test chip was also analyzed by the FEM considering the viscoelastic material properties of underfill (UF) resin [2] measured with the stress relaxation test and the elastic-plastic material properties of components measured with nano-indentation tests [3]. We improved the accuracy of the nonlinear finite elemant analysis using strain measurements made by the SEM-DICM.
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