抄録
Cu/AlN composites used as electronic devices have a problem with thermal stress. The thermal stress has an effect on residual strength of the composites. Here we report the residual strength of the Cu/AlN composites subjected to cyclic thermal loadings. We perform finite element analysis, cyclic thermal loading tests and residual strength on the Cu/AlN composites. The results reveal that microscopic damage of AlN substrates reduce the residual strength of the Cu/AlN composites.
