圧延銅箔の疲労特性に及ぼす厚さの影響

抄録

In this study, the effects of thickness on the tensile and fatigue properties of Cu thin films were investigated to understand mechanical behavior of Cu thin films. Both the tensile tests and fatigue tests were carried out using Oxygen-free Cu thin films. The thickness of the films was 15μm and 30μm, respectively. It was shown that both the tensile strength and fatigue strength of the 15μm thick film were lower than that of the 30μm thick film. The thickness effect on the fatigue strength was larger than th at on the tensile strength.