生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
セッションID: 221
会議情報
221 ETチップの設計条件(OS5 電子部品・光学部品の超精密加工)
今井 健一郎橋本 洋
著者情報
会議録・要旨集 フリー

詳細
抄録
ET (Engineered Tool) Chip has many small posts on a single crystal diamond surface. And, the post size, form, and distribution pattern can be designed flexibly. This report introduces the design conditions of ET Chip. The depth of cut for the single post [t] was calculated by the locus of post motion equations. And, it was shown that the [tmax] is concerned with | P(s+w) -λ|. (P (s+w) ; post spacing + post width, λ ; [cutting speed v] / [ultrasonic frequency f]) Furthermore, as the | P(s+w) -λ| value increases, the continuous cutting processes changes into the intermittent one. As a results, it was shown that the distribution pattern of post can be designed under P (s+w) -λ ≠0, λ<P (s+w)<2λ, λ>P (s+w)>λ/2 conditions.
著者関連情報
© 2001 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top