Al/Ni瞬間接合体内部のクラックとボイド形成に及ぼすAl接着層厚さの影響

抄録

Recently, electric vehicle (EV) developers demand high temperature operation in power devices. However, it is difficult in current EVs because solder materials with low melting point are used as adhesive. To realize the high temperature operation, Al becomes a strong candidate due to its higher melting point than typical solders. In recent research, it is shown that Al/Ni instantaneous joints include cracks in NiAl and voids into joint layer. Reducing the number of cracks and voids is critical to low thermal resistance. In this research, investigating the influence of Al adhesive on crack and void formation in Al/Ni reactively-bonded specimens.