抄録
With the advance of a forefront compact electronic system, a thermal design program, which generates a sufficiently precise result in relatively a short time, is demanded. In the JSME subcommittee, RC181, development of a novel thermal design method called Build-Up-Approach (BUA) is in progress by the work group on thermal design for the compact electronic system. In this paper, the thermal conductivity of the materials measured by Laser Flash method and the precise dimension of a model package, which is used for evaluating the program, was reported.
