抄録
Effect of additives on the degradation of adhesion strength between thick film conductor and multilayer ceramic substrate is studied with special reference to the microstructure. Degradation of adhesion strength is caused by the solder diffusion which brings about the expansion of Ag conductor and destruction of the interface between Ag conductor and multilayer ceramic substrate during ageing at 150°C.
Addition of precious metal such as Pd or Pt is effctive to prevent the degradation of adhesion strength. In the case of Ag conductor, γ-Ag3 Sn is easily formed during ageing. Addition of Pd or Pt suppress the formation of γ-Ag3 Sn. Accicular precipitates such as celsian is most effective in toughening the interfacial strength.
