液中プラズマと気泡圧壊による高アスペクト比加工への研究

抄録

For the present study, plasma-induced bubble generator with abrasive grain is proposed to obtain high aspect ratio hole processing. Previously our group has been invented plasma-induced bubble generator which can process wide range of material including conductive and non-conductive material and hard material such as carbon fiber. However there is certain limitation of aspect ratio of processed hole. Current study did evaluation of ability of processing in terms of conductivity of machining fluid and temperature concentration. Also, abrasive grain is introduced to accelerate the ability of processing with machining guide. This study contributes to achieve novel low-cost and high aspect ratio processing machine to process wide range of materials such as biological material to hard metal.