高分子超薄膜上配線と電子素子の直接接合による電気的接続の評価

抄録

We investigated electrical connection without soldering because materials for stretchable substrate are weak against heat. For electrical connection of an electronic component to the substrate, we proposed a method of direct bonding of an electrical component to printed wires on a polymeric ultra-film with the thickness of a few hundreds of nanometers. The electrical component is firmly bonded on the wire and we could not remove it without breaking the film. A good electrical connection was also achieved by the bonding. We revealed that the contact resistance is inversely proportional to the contact area and dependents on the surface profile.